As per Fact.MR, a market research and competitive intelligence provider, the global 3D through-silicon-via (TSV) devices market is expected to surge at a CAGR of 20% over the next ten years. 3D through-silicon-via technology is steadily gaining traction as a highly advanced semiconductor packaging model that dramatically improves chip performance and functionality. For saving space in the package, especially for next-generation products, and to meet demand from edge computing applications that require shorter reaction time and different structures, semiconductor manufacturers are increasingly using TSV techniques for chip stacking.
Driven by growing demand from global electronics manufacturers for innovative, high-performance chip architectures and designs in advanced packaging with superior performance, power consumption, and form factor features, 3D through-silicon-via technology has made rapid progress within the global semiconductor sector. In addition, variables such as proliferation in cloud-based apps, solid information & communication technology perspective, and ongoing advances in DRAM and intelligent lighting, industries are adopting 3D TSV devices for manufacturing processes.
The future of the 3D through-silicon-via devices market looks promising with opportunities in consumer electronics, information and communication technology, automotive, military, aerospace, and defense industries.
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Key Segments in 3D TSV Devices Industry Research
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Product
- 3D TSV Memory
- 3D TSV Advanced LED Packaging
- 3D TSV CMOS Image Sensors
- 3D TSV Imaging and Opto-Electronics
- 3D TSV MEMS
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Process Realization
- 3D TSV Devices Via First Process Realization
- 3D TSV Devices Via Middle Process Realization
- 3D TSV Devices Via Last Process Realization
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Application
- Use of 3D TSV Devices in Consumer Electronics
- Use of 3D TSV Devices in Mobile Devices
- Use of 3D TSV Devices in Processors in Computers and Laptops
- Use of 3D TSV Devices in Automotive Sector
- Use of 3D TSV Devices in Automotive Sensors
- Use of 3D TSV Devices in Automotive Body Electronics
- Use of 3D TSV Devices in IT and Telecom
- Use of 3D TSV Devices in Communications
- Use of 3D TSV Devices in Information Technology & Networking
- Use of 3D TSV Devices in Healthcare Sector
- Use of 3D TSV Devices in Military, Aerospace & Defense Sector
- Use of 3D TSV Devices in Consumer Electronics
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Key Takeaways from Market Study
- Global 3D through-silicon-via devices market to top US$ 15 Bn by 2031.
- 3D TSV memory projected to reach around US$ 5 Bn by 2031.
- CMOS image sensors projected to record above 18% CAGR over next 10 years.
- Market in Asia Pacific holds share of more than 50%.
- Market in Japan expected to reach valuation of US$ 3 Bn by 2031.
- Market in South Korea to record 16% CAGR over forecast period of 2021- 2031.
Market Competition
Various prominent players operating in the 3D TSV devices market are focusing on the expansion of their business operations in emerging regions.
- In April 2019, TSMC introduced ANSYS (ANSS) solutions for sophisticated 3D chip stacking technology for its innovative system-on-integrated chips (TSMC-SoIC) in order to enable customers with greater performance and power efficiency for highly complex and demanding cloud and data center applications.
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More Valuable Insights Available
Fact.MR, in its new offering, presents an unbiased analysis of the 3D through-silicon-via devices market, presenting historical demand data (2016-2020) and forecast statistics for the period of 2021-2031.
The study divulges essential insights on the market on the basis of product (memory, advanced LED packaging, CMOS image sensors, imaging and opto-electronics, and MEMs), process realization (via first, via middle, and via last), and application (consumer electronics, automotive sector, IT and telecom, healthcare sector, and military, aerospace & defense sector), across seven major regions of the world (North America, Latin America, Europe, East Asia, South Asia, Oceania, and the Middle East & Africa).
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